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1 Ergebnisse
1
Thermomechanical and Electrical Material Characterization f..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Thalhamer, A.
;
Rossegger, E.
;
Hasil, S.
... - p. 1-10 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100754
RT T1 <cTitle>2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10100754&Exemplar=1&LAN=DE A1 Thalhamer, A. A1 Rossegger, E. A1 Hasil, S. A1 Hrbinic, K. A1 Feigl, V. A1 Pfost, M. A1 Fuchs, P. YR 2023 SN 2833-8596 K1 Temperature measurement K1 Heating systems K1 Solid modeling K1 Thermomechanical processes K1 Conductivity K1 Three-dimensional printing K1 Thermal conductivity SP 1 OP 10 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100754 DO https://doi.org/10.1109/EuroSimE56861.2023.10100754 SF ELIB - SuUB Bremen
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