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1 Ergebnisse
1
Micro-cantilever Bending Test of Sintered Cu nanoparticles ..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Du, Leiming
;
Hu, Dong
;
Poelm, Rene
.. - p. 1-4 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100756
RT T1 <cTitle>2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10100756&Exemplar=1&LAN=DE A1 Du, Leiming A1 Hu, Dong A1 Poelm, Rene A1 Driel, Willem Van A1 Zhang, Kouchi YR 2023 SN 2833-8596 K1 Nanoparticles K1 Thermal resistance K1 Bending K1 Silicon K1 Power electronics K1 Time measurement K1 Thermal analysis SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100756 DO https://doi.org/10.1109/EuroSimE56861.2023.10100756 SF ELIB - SuUB Bremen
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