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Reduction of empiricism in the solder joint reliability ass..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Soestbergen, M. van
;
Roucou, R.
;
Rebosolan, M.
. - p. 1-6 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100761
RT T1 <cTitle>2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Reduction of empiricism in the solder joint reliability assessment of QFN packages by using thermo-mechanical simulations</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10100761&Exemplar=1&LAN=DE A1 Soestbergen, M. van A1 Roucou, R. A1 Rebosolan, M. A1 M Zaal, J.J. YR 2023 SN 2833-8596 K1 Measurement K1 Correlation K1 Computational modeling K1 Thermomechanical processes K1 Failure analysis K1 Fatigue K1 Intermetallic SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100761 DO https://doi.org/10.1109/EuroSimE56861.2023.10100761 SF ELIB - SuUB Bremen
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