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Thermal management of vertical GaN transistors:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Mitterhuber, Lisa
;
Leitgeb, Verena
;
Krainz, Markus
... - p. 1-8 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100765
RT T1
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
: T1
Thermal management of vertical GaN transistors
UL https://suche.suub.uni-bremen.de/peid=ieee-10100765&Exemplar=1&LAN=DE A1 Mitterhuber, Lisa A1 Leitgeb, Verena A1 Krainz, Markus A1 Strauss, Robert A1 Kaden, Thomas A1 Treidel, Eldad Bahat A1 Brunner, Frank A1 Huber, Christian A1 Kraker, Elke YR 2023 SN 2833-8596 K1 Performance evaluation K1 Thermal resistance K1 Conductivity K1 Thermal conductivity K1 Thermal management K1 Silicon K1 Thermal analysis SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100765 DO https://doi.org/10.1109/EuroSimE56861.2023.10100765 SF ELIB - SuUB Bremen
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