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1 Ergebnisse
1
TC Reliability Enhancement Technology for SSD with Low Temp..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Kim, Junghoon
;
Jung, Yong
;
Oh, Eunho
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100767
RT T1 <cTitle>2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>TC Reliability Enhancement Technology for SSD with Low Temperature Solder Paste Material</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10100767&Exemplar=1&LAN=DE A1 Kim, Junghoon A1 Jung, Yong A1 Oh, Eunho A1 Cinar, Yusuf A1 Jeong, Jongwook A1 Lee, Sungki A1 Park, Jonggyu YR 2023 SN 2833-8596 K1 Micromechanical devices K1 Mass production K1 Temperature K1 Random access memory K1 Materials reliability K1 Reliability engineering K1 Microelectronics SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100767 DO https://doi.org/10.1109/EuroSimE56861.2023.10100767 SF ELIB - SuUB Bremen
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