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1 Ergebnisse
1
Reactive Die Bonding on LTCC Substrates – Analysis by CFD S..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Wiss, Erik
;
Yuile, Adam
;
Schulz, Alexander
.. - p. 1-5 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100772
RT T1 <cTitle>2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Reactive Die Bonding on LTCC Substrates – Analysis by CFD Simulation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10100772&Exemplar=1&LAN=DE A1 Wiss, Erik A1 Yuile, Adam A1 Schulz, Alexander A1 Muller, Jens A1 Wiese, Steffen YR 2023 SN 2833-8596 K1 Temperature measurement K1 Heating systems K1 Micromechanical devices K1 Adaptation models K1 Atmospheric modeling K1 Computational fluid dynamics K1 Computational modeling SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100772 DO https://doi.org/10.1109/EuroSimE56861.2023.10100772 SF ELIB - SuUB Bremen
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