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Transient Thermal 2D FEM Analysis of SiC Mosfet in Short-Ci..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Sarraute, Emmanuel
;
Cazimajou, Thibauld
;
Richardeau, Frederic
- p. 1-8 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100775
RT T1 <cTitle>2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Transient Thermal 2D FEM Analysis of SiC Mosfet in Short-Circuit Operation Including Solidus-Liquidus Phase Transition of the Aluminum Source Electrode</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10100775&Exemplar=1&LAN=DE A1 Sarraute, Emmanuel A1 Cazimajou, Thibauld A1 Richardeau, Frederic YR 2023 SN 2833-8596 K1 Semiconductor device modeling K1 Electrodes K1 Heating systems K1 MOSFET K1 Silicon carbide K1 Thermal conductivity K1 Power transistors SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100775 DO https://doi.org/10.1109/EuroSimE56861.2023.10100775 SF ELIB - SuUB Bremen
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