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Characterization and simulation of delamination on package-..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Kniely, R.
;
Heilmann, J.
;
Huber, F.
. - p. 1-11 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100778
RT T1
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
: T1
Characterization and simulation of delamination on package-level considering sub-critical interfacial fracture-parameters under cyclic loading
UL https://suche.suub.uni-bremen.de/peid=ieee-10100778&Exemplar=1&LAN=DE A1 Kniely, R. A1 Heilmann, J. A1 Huber, F. A1 Wunderle, B. YR 2023 SN 2833-8596 K1 Loading K1 Bending K1 Fatigue K1 Silicon K1 Behavioral sciences K1 Microelectronics K1 Reliability SP 1 OP 11 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100778 DO https://doi.org/10.1109/EuroSimE56861.2023.10100778 SF ELIB - SuUB Bremen
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