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Modeling of in-plane distortions and overlay errors encount..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Okudur, Oguzhan Orkut
;
Gonzalez, Mario
;
Van Den Bosch, Geert
. - p. 1-5 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100780
RT T1 <cTitle>2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Modeling of in-plane distortions and overlay errors encountered during 3-D NAND flash device fabrication</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10100780&Exemplar=1&LAN=DE A1 Okudur, Oguzhan Orkut A1 Gonzalez, Mario A1 Van Den Bosch, Geert A1 Rosmeulen, Maarten YR 2023 SN 2833-8596 K1 Fabrication K1 Micromechanical devices K1 Solid modeling K1 Nonlinear distortion K1 Microelectronics K1 Integrated circuit modeling K1 Flash memories SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100780 DO https://doi.org/10.1109/EuroSimE56861.2023.10100780 SF ELIB - SuUB Bremen
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