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1 Ergebnisse
1
Leadframe-Epoxy Moulding Compound Adhesion: a Micromechanic..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Porta, Alessandro Della
;
Mariani, Stefano
;
Rovitto, Marco
.. - p. 1-7 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100792
RT T1 <cTitle>2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Leadframe-Epoxy Moulding Compound Adhesion: a Micromechanics-driven Investigation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10100792&Exemplar=1&LAN=DE A1 Porta, Alessandro Della A1 Mariani, Stefano A1 Rovitto, Marco A1 Andena, Luca A1 Zalaffi, Samuele YR 2023 SN 2833-8596 K1 Adhesives K1 Surface morphology K1 Morphology K1 Lead K1 Electromagnetic compatibility K1 Surface roughness K1 Rough surfaces SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100792 DO https://doi.org/10.1109/EuroSimE56861.2023.10100792 SF ELIB - SuUB Bremen
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