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Degradation of silicone-based sealing materials used in mic..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Mehr, Maryam Yazdan
;
Hajipour, Pejman
;
Zeijl, H.van
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100796
RT T1 <cTitle>2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Degradation of silicone-based sealing materials used in microelectronics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10100796&Exemplar=1&LAN=DE A1 Mehr, Maryam Yazdan A1 Hajipour, Pejman A1 Zeijl, H.van A1 van El, W.D. A1 Cooremans, Thierry A1 Buyl, Francois. De A1 Zhang, G.Q. YR 2023 SN 2833-8596 K1 Sealing materials K1 Degradation K1 Temperature K1 Failure analysis K1 Humidity K1 Stability analysis K1 Microelectronics SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100796 DO https://doi.org/10.1109/EuroSimE56861.2023.10100796 SF ELIB - SuUB Bremen
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