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Microstructure Analysis Based on 3D reconstruction Model an..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),

Hu, X. ; Martina, H.A. ; Poelma, R.H.... - p. 1-7 , 2023

Link: https://doi.org/10.1109/EuroSimE56861.2023.10100799

RT 
T1 <cTitle>2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10100799&Exemplar=1&LAN=DE
				
A1 Hu, X.
A1 Martina, H.A.
A1 Poelma, R.H.
A1 Huang, J.L.
A1 Rijckevorsel, H.
A1 Scholten, H.
A1 Smits, E.C.P.
A1 Van Driel, W.D.
A1 Zhang, G.Q.
YR 2023
SN 2833-8596
K1 Temperature measurement
K1 Semiconductor device measurement
K1 Solid modeling
K1 Three-dimensional displays
K1 Thermal resistance
K1 Sintering
K1 Electronic packaging thermal management
K1 Hybrid Ag Sintering
K1 Pressureless Sintering
K1 3D Reconstruction
K1 Microstructure Analysis
K1 Tortuosity
K1 Transient Thermal Impedance
K1 LDMOS Body Diode Measurement
SP 1
OP 7
LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100799
DO https://doi.org/10.1109/EuroSimE56861.2023.10100799
SF ELIB - SuUB Bremen

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