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Evaluation of thermomechanical behavior of electronic devic..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Weninger, M.
;
Zundel, J.
;
Krivec, T.
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100800
RT T1 <cTitle>2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10100800&Exemplar=1&LAN=DE A1 Weninger, M. A1 Zundel, J. A1 Krivec, T. A1 Frewein, M. A1 Waschnig, S. A1 Fuchs, P. A1 Obst, C. YR 2023 SN 2833-8596 K1 Micromechanical devices K1 Temperature K1 Computational modeling K1 Simulation K1 Thermomechanical processes K1 Printed circuits K1 Predictive models SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100800 DO https://doi.org/10.1109/EuroSimE56861.2023.10100800 SF ELIB - SuUB Bremen
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