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1
Failure Prediction and Analysis of an IGBT Module for Indus..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Dudek, Rainer
;
Otto, Alexander
;
Doring, Ralf
... - p. 1-11 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100806
RT T1 <cTitle>2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Failure Prediction and Analysis of an IGBT Module for Industrial Applications Subjected to Passive and Power Cycling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10100806&Exemplar=1&LAN=DE A1 Dudek, Rainer A1 Otto, Alexander A1 Doring, Ralf A1 Mathew, Anu A1 Liu, Xing A1 Rzepka, Sven YR 2023 SN 2833-8596 K1 Insulated gate bipolar transistors K1 Wires K1 Thermomechanical processes K1 Predictive models K1 Reliability K1 Bonding K1 Substrates SP 1 OP 11 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100806 DO https://doi.org/10.1109/EuroSimE56861.2023.10100806 SF ELIB - SuUB Bremen
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