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1 Ergebnisse
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Improving the Vibration Reliability of SAC Flip-Chip Interc..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Hohne, Robert
;
Meier, Karsten
;
Reim, Michael
.. - p. 1-4 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100809
RT T1
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
: T1
Improving the Vibration Reliability of SAC Flip-Chip Interconnects Using Underfill
UL https://suche.suub.uni-bremen.de/peid=ieee-10100809&Exemplar=1&LAN=DE A1 Hohne, Robert A1 Meier, Karsten A1 Reim, Michael A1 Lehmann, Marco A1 Bock, Karl-Heinz YR 2023 SN 2833-8596 K1 Vibrations K1 Thermal resistance K1 Metals K1 Fatigue K1 Reliability K1 Flip-chip devices K1 Weibull distribution K1 Harsh environment reliability K1 harmonic vibration K1 Flip-Chip K1 failure analysis K1 reliability analysis K1 lead-free solder alloy SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100809 DO https://doi.org/10.1109/EuroSimE56861.2023.10100809 SF ELIB - SuUB Bremen
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