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1 Ergebnisse
1
Finite Element Model for Prediction of Back-End-of-Line Pro..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Singh, Prashant Kumar
;
Machani, Kashi Vishwanath
;
Breuer, Dirk
... - p. 1-10 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100826
RT T1
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
: T1
Finite Element Model for Prediction of Back-End-of-Line Process Induced Wafer Bow for Patterned Wafer
UL https://suche.suub.uni-bremen.de/peid=ieee-10100826&Exemplar=1&LAN=DE A1 Singh, Prashant Kumar A1 Machani, Kashi Vishwanath A1 Breuer, Dirk A1 Hecker, Michael A1 Meier, Karsten A1 Kuechenmeister, Frank A1 Wieland, Marcel A1 Bock, Karlheinz YR 2023 SN 2833-8596 K1 Semiconductor device modeling K1 Fabrication K1 Micromechanical devices K1 Electronics industry K1 Metals K1 Predictive models K1 Finite element analysis K1 Wafer bow K1 wafer warpage K1 finite element modelling K1 back-end-of-line SP 1 OP 10 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100826 DO https://doi.org/10.1109/EuroSimE56861.2023.10100826 SF ELIB - SuUB Bremen
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