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1 Ergebnisse
1
FEA-based Layout Optimization of E1.S Solid-State Drive to ..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Oh, Eunho
;
Kim, Junghoon
;
Cinar, Yusuf
... - p. 1-7 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100844
RT T1 <cTitle>2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>FEA-based Layout Optimization of E1.S Solid-State Drive to Improve Thermal Cycling Reliability</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10100844&Exemplar=1&LAN=DE A1 Oh, Eunho A1 Kim, Junghoon A1 Cinar, Yusuf A1 Kim, Woosung A1 Lee, Byungil A1 Jang, Myungryul A1 Song, Namho A1 Lee, Sungki A1 Park, Jonggyu YR 2023 SN 2833-8596 K1 Temperature K1 Solid state drives K1 Layout K1 Fasteners K1 Fatigue K1 Reliability K1 Plastics SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100844 DO https://doi.org/10.1109/EuroSimE56861.2023.10100844 SF ELIB - SuUB Bremen
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