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A Closer Look to Fan-out Panel Level Packaging:
, In:
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
,
Braun, Tanja
;
Holck, Ole
;
Voitel, Marcus
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/EDTM55494.2023.10102969
RT T1 <cTitle>2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)</cTitle>: T1 <Title>A Closer Look to Fan-out Panel Level Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10102969&Exemplar=1&LAN=DE A1 Braun, Tanja A1 Holck, Ole A1 Voitel, Marcus A1 Obst, Mattis A1 Voges, Steve A1 Becker, Karl-Friedrich A1 Aschenbrenner, Rolf A1 Schneider-Ramelow, Martin YR 2023 K1 Packaging K1 Market research K1 Manufacturing K1 Microelectronics K1 Compression molding K1 Fan-out Panel Level Packaging K1 Warpage and Compression Molding SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDTM55494.2023.10102969 DO https://doi.org/10.1109/EDTM55494.2023.10102969 SF ELIB - SuUB Bremen
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