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Low temperature SiCN as dielectric for hybrid bonding:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Kumar Channam, Venkat Sunil ; Iacovo, Serena ; Walsby, Edward... - p. 1-3 , 2023
Link: https://doi.org/10.1109/EDTM55494.2023.10103036