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1 Ergebnisse
1
Low temperature SiCN as dielectric for hybrid bonding:
, In:
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
,
Kumar Channam, Venkat Sunil
;
Iacovo, Serena
;
Walsby, Edward
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/EDTM55494.2023.10103036
RT T1
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
: T1
Low temperature SiCN as dielectric for hybrid bonding
UL https://suche.suub.uni-bremen.de/peid=ieee-10103036&Exemplar=1&LAN=DE A1 Kumar Channam, Venkat Sunil A1 Iacovo, Serena A1 Walsby, Edward A1 Belov, Igor A1 Jourdain, Anne A1 Sepulveda, Alfonso A1 Beyne, Eric YR 2023 K1 Wafer bonding K1 Temperature K1 Stacking K1 Moisture K1 Dielectrics K1 Manufacturing K1 Reliability K1 PECVD K1 Low temperature SiCN K1 Hybrid Bonding and Cu Diffusion barrier SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDTM55494.2023.10103036 DO https://doi.org/10.1109/EDTM55494.2023.10103036 SF ELIB - SuUB Bremen
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