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1 Ergebnisse
1
A Broadband, Via-Less, and Reusable Characterization Method..:
, In:
2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
,
Song, Xiao Xuan
;
Wu, Ya Fei
;
Guo, Yongxin
. - p. 1-3 , 2022
Link:
https://doi.org/10.1109/IMWS-AMP54652.2022.10107181
RT T1
2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
: T1
A Broadband, Via-Less, and Reusable Characterization Method for Advanced Packaging Materials with Multimode Gap Waveguide Resonator
UL https://suche.suub.uni-bremen.de/peid=ieee-10107181&Exemplar=1&LAN=DE A1 Song, Xiao Xuan A1 Wu, Ya Fei A1 Guo, Yongxin A1 Cheng, Yu Jian YR 2022 SN 2694-2992 K1 Microwave measurement K1 Permittivity measurement K1 Gap waveguide K1 Resonant frequency K1 Metals K1 Packaging K1 Loss measurement K1 broadband measurement K1 dielectric constant K1 dielectric loss tangent K1 gap waveguide K1 multimode measurement K1 via-less SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IMWS-AMP54652.2022.10107181 DO https://doi.org/10.1109/IMWS-AMP54652.2022.10107181 SF ELIB - SuUB Bremen
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