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1 Ergebnisse
1
Reliability Modeling of Middle-Of-Line Interconnect Dielect..:
, In:
2023 IEEE International Reliability Physics Symposium (IRPS)
,
Kasim, R.
;
Lin, C.
;
Perini, C.
... - p. 1-8 , 2023
Link:
https://doi.org/10.1109/IRPS48203.2023.10117619
RT T1 <cTitle>2023 IEEE International Reliability Physics Symposium (IRPS)</cTitle>: T1 <Title>Reliability Modeling of Middle-Of-Line Interconnect Dielectrics in Advanced process nodes</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10117619&Exemplar=1&LAN=DE A1 Kasim, R. A1 Lin, C. A1 Perini, C. A1 Palmer, J. A1 Gilda, N. A1 Imam, S. A1 Weber, J. R. A1 Wallace, C. A1 Hicks, J. YR 2023 SN 1938-1891 K1 Systematics K1 Sociology K1 Process control K1 Tail K1 Aerospace electronics K1 Dielectrics K1 Dielectric breakdown K1 component K1 Interconnect dielectric Reliability K1 Middle of Line Reliability K1 low-k reliability K1 low-k TDDB SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/IRPS48203.2023.10117619 DO https://doi.org/10.1109/IRPS48203.2023.10117619 SF ELIB - SuUB Bremen
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