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Reliability Challenges from 2.5D to 3DIC in Advanced Packag..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Lu, Ryan ; Chuang, Yao-Chun ; Wu, Jyun-Lin. - p. 1-4 , 2023
Link: https://doi.org/10.1109/IRPS48203.2023.10117647