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1
Advanced Methods of Detecting Physical Damages in Packaging..:
, In:
2023 IEEE International Reliability Physics Symposium (IRPS)
,
Mendoza, Jorge
;
Le, Jimmy-Bao
;
Kim, Choong-Un
. - p. 1-6 , 2023
Link:
https://doi.org/10.1109/IRPS48203.2023.10117720
RT T1 <cTitle>2023 IEEE International Reliability Physics Symposium (IRPS)</cTitle>: T1 <Title>Advanced Methods of Detecting Physical Damages in Packaging and BEOL Interconnects</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10117720&Exemplar=1&LAN=DE A1 Mendoza, Jorge A1 Le, Jimmy-Bao A1 Kim, Choong-Un A1 Lin, Hung-Yun YR 2023 SN 1938-1891 K1 Resistance K1 Sensitivity K1 Impedance measurement K1 Integrated circuit interconnections K1 Metals K1 Packaging K1 Capacitance K1 silicon-package-interaction K1 chip-package-interaction K1 interconnect failures K1 low-frequency impedance spectroscopy K1 nondestructive damage detection SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/IRPS48203.2023.10117720 DO https://doi.org/10.1109/IRPS48203.2023.10117720 SF ELIB - SuUB Bremen
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