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1 Ergebnisse
1
Stress Migration of Aluminum Backside Interconnect in Xtack..:
, In:
2023 IEEE International Reliability Physics Symposium (IRPS)
,
Yang, Kang
;
Yang, Suhui
;
Ouyang, Yan
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/IRPS48203.2023.10117817
RT T1 <cTitle>2023 IEEE International Reliability Physics Symposium (IRPS)</cTitle>: T1 <Title>Stress Migration of Aluminum Backside Interconnect in Xtacking®</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10117817&Exemplar=1&LAN=DE A1 Yang, Kang A1 Yang, Suhui A1 Ouyang, Yan A1 Yang, Shengwei A1 Han, Kun A1 He, Yi YR 2023 SN 1938-1891 K1 Three-dimensional displays K1 Simulation K1 Semiconductor device reliability K1 Integrated circuit interconnections K1 Computer architecture K1 Numerical simulation K1 Routing K1 backside interconnects K1 stress migration K1 numerical simulation SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IRPS48203.2023.10117817 DO https://doi.org/10.1109/IRPS48203.2023.10117817 SF ELIB - SuUB Bremen
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