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1 Ergebnisse
1
Development and Product Reliability Characterization of Adv..:
, In:
2023 IEEE International Reliability Physics Symposium (IRPS)
,
Lee, S.
;
Lee, N-H
;
Lee, KW.
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/IRPS48203.2023.10117889
RT T1 <cTitle>2023 IEEE International Reliability Physics Symposium (IRPS)</cTitle>: T1 <Title>Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10117889&Exemplar=1&LAN=DE A1 Lee, S. A1 Lee, N-H A1 Lee, KW. A1 Kim, JH. A1 Jin, JH. A1 Lee, YS. A1 Hwang, YC A1 Kim, HS. A1 Pae, S. YR 2023 SN 1938-1891 K1 Temperature sensors K1 Temperature measurement K1 Random access memory K1 Production K1 Error correction codes K1 Reliability K1 Servers K1 DRAM K1 NBTI K1 on-die ECC K1 single bit errors SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IRPS48203.2023.10117889 DO https://doi.org/10.1109/IRPS48203.2023.10117889 SF ELIB - SuUB Bremen
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