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Towards Chip-Package-System Co-optimization of Thermally-li..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),

Mishra, S. ; Sankatali, V. ; Vermeersch, B.... - p. 1-7 , 2023

Link: https://doi.org/10.1109/IRPS48203.2023.10117979

RT 
T1 <cTitle>2023 IEEE International Reliability Physics Symposium (IRPS)</cTitle>: T1 <Title>Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10117979&Exemplar=1&LAN=DE
				
A1 Mishra, S.
A1 Sankatali, V.
A1 Vermeersch, B.
A1 Brunion, M.
A1 Lofrano, M.
A1 Abdi, D.
A1 Oprins, H.
A1 Biswas, D.
A1 Zografos, O.
A1 Hiblot, G.
A1 Van Der Plas, G.
A1 Weckx, P.
A1 Hellings, G.
A1 Myers, J.
A1 Catthoor, F.
A1 Ryckaert, J.
YR 2023
SN 1938-1891
K1 Temperature distribution
K1 Cooling
K1 Thermal resistance
K1 Thermal management
K1 Dynamic scheduling
K1 Thermal analysis
K1 System-on-chip
K1 3DFEM
K1 cooling
K1 co-optimization
K1 floor planning
K1 heat sink
K1 hotspot
K1 junction temperature
K1 packaging
K1 power density
K1 scaling
K1 SoC
K1 system-on-chip
K1 thermal analysis
K1 thermal interface material
K1 thermal resistance
K1 TIM
SP 1
OP 7
LK http://dx.doi.org/https://doi.org/10.1109/IRPS48203.2023.10117979
DO https://doi.org/10.1109/IRPS48203.2023.10117979
SF ELIB - SuUB Bremen

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