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1 Ergebnisse
1
Industrial approach to the chip and package reliability of ..:
, In:
2023 IEEE International Reliability Physics Symposium (IRPS)
,
Mengotti, Elena
;
Bianda, Enea
;
Baumann, David
.. - p. 1-6 , 2023
Link:
https://doi.org/10.1109/IRPS48203.2023.10118084
RT T1 <cTitle>2023 IEEE International Reliability Physics Symposium (IRPS)</cTitle>: T1 <Title>Industrial approach to the chip and package reliability of SiC MOSFETs (Invited)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10118084&Exemplar=1&LAN=DE A1 Mengotti, Elena A1 Bianda, Enea A1 Baumann, David A1 Schlottig, Gerd A1 Canales, Francisco YR 2023 SN 1938-1891 K1 Performance evaluation K1 MOSFET K1 Silicon carbide K1 Failure analysis K1 Switches K1 Silicon K1 Reliability K1 reliability K1 SiC power MOSFETs K1 tests K1 power cycling K1 gate oxide SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/IRPS48203.2023.10118084 DO https://doi.org/10.1109/IRPS48203.2023.10118084 SF ELIB - SuUB Bremen
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