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Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 H..:
, In:
2023 IEEE International Reliability Physics Symposium (IRPS)
,
Moreau, S.
;
Bouchu, D.
;
Jourdon, J.
... - p. 1-7 , 2023
Link:
https://doi.org/10.1109/IRPS48203.2023.10118173
RT T1 <cTitle>2023 IEEE International Reliability Physics Symposium (IRPS)</cTitle>: T1 <Title>Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10118173&Exemplar=1&LAN=DE A1 Moreau, S. A1 Bouchu, D. A1 Jourdon, J. A1 Ayoub, B. A1 Lhostis, S. A1 Fremont, H. A1 Lamontagne, P. YR 2023 SN 1938-1891 K1 Electromigration K1 Resistance K1 Degradation K1 Three-dimensional displays K1 Integrated circuit interconnections K1 Bonding K1 Integrated circuit reliability K1 3D integration K1 hybrid bonding K1 interconnects K1 reliability K1 failure mode K1 electromigration SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/IRPS48203.2023.10118173 DO https://doi.org/10.1109/IRPS48203.2023.10118173 SF ELIB - SuUB Bremen
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