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1 Ergebnisse
1
Reliability challenges in Forksheet Devices: (Invited Paper:
, In:
2023 IEEE International Reliability Physics Symposium (IRPS)
,
Bury, E.
;
Vandemaele, M.
;
Franco, J.
... - p. 1-8 , 2023
Link:
https://doi.org/10.1109/IRPS48203.2023.10118269
RT T1 <cTitle>2023 IEEE International Reliability Physics Symposium (IRPS)</cTitle>: T1 <Title>Reliability challenges in Forksheet Devices: (Invited Paper)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10118269&Exemplar=1&LAN=DE A1 Bury, E. A1 Vandemaele, M. A1 Franco, J. A1 Chasin, A. A1 Tyaginov, S. A1 Vandooren, A. A1 Ritzenthaler, R. A1 Mertens, H. A1 Fortuny, J. Diaz A1 Horiguchi, N. A1 Linten, D. A1 Kaczer, B. YR 2023 SN 1938-1891 K1 Performance evaluation K1 Silicon compounds K1 Semiconductor device reliability K1 Capacitors K1 Computer architecture K1 Threshold voltage K1 Dielectrics K1 Forksheet FETs K1 FSH K1 BDI K1 Nanosheet FETs K1 NSH K1 hot-carrier degradation K1 HCD K1 trapping K1 oxide defects K1 FET arrays K1 bottom dielectric isolation SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/IRPS48203.2023.10118269 DO https://doi.org/10.1109/IRPS48203.2023.10118269 SF ELIB - SuUB Bremen
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