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1
The in-mold thermocompression bonding process of microfluid..:
, In:
2022 8th International Conference on Nanomanufacturing & 4th AET Symposium on ACSM and Digital Manufacturing (Nanoman-AETS)
,
Zhao, Baishun
;
Wu, Wangqing
;
Jiang, Bingyan
- p. 1-6 , 2022
Link:
https://doi.org/10.1109/Nanoman-AETS56035.2022.1011948
RT T1 <cTitle>2022 8th International Conference on Nanomanufacturing & 4th AET Symposium on ACSM and Digital Manufacturing (Nanoman-AETS)</cTitle>: T1 <Title>The in-mold thermocompression bonding process of microfluidic chips based on the highly dynamic variotherm technology: Process characteristics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10119480&Exemplar=1&LAN=DE A1 Zhao, Baishun A1 Wu, Wangqing A1 Jiang, Bingyan YR 2022 K1 Temperature K1 Point of care K1 Production K1 Stability analysis K1 Raw materials K1 Bonding K1 Microfluidics K1 Microfluidic Chips K1 thymol bonding K1 In-mold thermocompression bonding K1 manufacturing of microfluidic Chips K1 Micro-injection molding SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/Nanoman-AETS56035.2022.10119480 DO https://doi.org/10.1109/Nanoman-AETS56035.2022.10119480 SF ELIB - SuUB Bremen
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