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Curvature measurements to improve polymer integration in mi..:
, In:
2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
,
Vavrille, Benjamin
;
Vignoud, Lionel
;
Chapelon, Laurent-Luc
. - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ASMC57536.2023.10121100
RT T1 <cTitle>2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</cTitle>: T1 <Title>Curvature measurements to improve polymer integration in microelectronic devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10121100&Exemplar=1&LAN=DE A1 Vavrille, Benjamin A1 Vignoud, Lionel A1 Chapelon, Laurent-Luc A1 Estevez, Rafael YR 2023 SN 2376-6697 K1 Temperature measurement K1 Thermal expansion K1 Semiconductor device measurement K1 Temperature K1 Thermomechanical processes K1 Estimation K1 Microelectronics K1 Thermally induced curvature K1 polymer K1 coefficient of thermal expansion K1 Young's modulus K1 Poisson's ratio K1 glass transition K1 thermal stress K1 bilayer K1 characterization techniques K1 glassy state K1 rubbery state K1 ellipsometry K1 picosecond ultrasonics SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ASMC57536.2023.10121100 DO https://doi.org/10.1109/ASMC57536.2023.10121100 SF ELIB - SuUB Bremen
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