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1 Ergebnisse
1
Common Source Line-to-Word Line Short Improvement by Elimin..:
, In:
2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
,
Chung, Yao-An
;
Chu, Yuan-Chieh
;
Chang, Chih-Chin
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ASMC57536.2023.10121114
RT T1 <cTitle>2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</cTitle>: T1 <Title>Common Source Line-to-Word Line Short Improvement by Eliminating SLT Sidewall Notch in 3D NAND Deep Trench Patterning</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10121114&Exemplar=1&LAN=DE A1 Chung, Yao-An A1 Chu, Yuan-Chieh A1 Chang, Chih-Chin A1 Lee, Hong-Ji A1 Lian, Nan-Tzu A1 Yang, Tahone A1 Chen, Kuang-Chao A1 Lu, Chih-Yuan YR 2023 SN 2376-6697 K1 Three-dimensional displays K1 Failure analysis K1 Semiconductor device manufacture K1 Hardware K1 Etching K1 Plasmas K1 Trajectory K1 3D NAND K1 slit etch K1 high aspect ratio etch K1 WL leakage K1 plasma tilting K1 profile notch SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ASMC57536.2023.10121114 DO https://doi.org/10.1109/ASMC57536.2023.10121114 SF ELIB - SuUB Bremen
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