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Combining Full Wafer Inspection with Deep Learning to Recog..:
, In:
2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
,
Anger, Sabrina
;
Yayak, Anil Bora
;
Roeder, Georg
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ASMC57536.2023.10121122
RT T1 <cTitle>2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</cTitle>: T1 <Title>Combining Full Wafer Inspection with Deep Learning to Recognize Wafers with Critical Defects</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10121122&Exemplar=1&LAN=DE A1 Anger, Sabrina A1 Yayak, Anil Bora A1 Roeder, Georg A1 Schellenberger, Martin A1 Sipocz, Tamas A1 Alcaire, Thomas A1 Cunff, Delphine Le A1 Nagy, Mate YR 2023 SN 2376-6697 K1 Deep learning K1 Semiconductor device measurement K1 Semiconductor device reliability K1 Production K1 Photoluminescence K1 Inspection K1 Classification algorithms K1 Process control K1 Photoluminescence imaging K1 Classification K1 ResNet K1 Grad-CAM SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ASMC57536.2023.10121122 DO https://doi.org/10.1109/ASMC57536.2023.10121122 SF ELIB - SuUB Bremen
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