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1 Ergebnisse
1
A 72-Channel Resistive-and-Capacitive Sensor Interface Achi..:
, In:
2023 IEEE Custom Integrated Circuits Conference (CICC)
,
Feng, Xiangdong
;
Luo, Yuxuan
;
Cai, Tianyi
... - p. 1-2 , 2023
Link:
https://doi.org/10.1109/CICC57935.2023.10121283
RT T1 <cTitle>2023 IEEE Custom Integrated Circuits Conference (CICC)</cTitle>: T1 <Title>A 72-Channel Resistive-and-Capacitive Sensor Interface Achieving 0.74 μ W/ Channel and 0.038 mm2/ Channel by Noise-Orthogonalizing and Pad-Sharing Techniques</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10121283&Exemplar=1&LAN=DE A1 Feng, Xiangdong A1 Luo, Yuxuan A1 Cai, Tianyi A1 Xuan, Yangfan A1 Zhang, Yunshan A1 Shen, Yili A1 Yang, Changgui A1 Xiao, Qijing A1 Chen, Yong A1 Zhao, Bo YR 2023 SN 2152-3630 K1 Temperature sensors K1 Application specific integrated circuits K1 Demultiplexing K1 Transducers K1 Power demand K1 Humidity K1 Sensor systems SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/CICC57935.2023.10121283 DO https://doi.org/10.1109/CICC57935.2023.10121283 SF ELIB - SuUB Bremen
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