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1 Ergebnisse
1
Modelling and Analysis of different types of TSV for Three ..:
, In:
2023 International Conference on Networking and Communications (ICNWC)
,
Subhashini, G.
;
Vairaprakash, S.
;
Chandralekha, R.
... - p. 1-10 , 2023
Link:
https://doi.org/10.1109/ICNWC57852.2023.10127533
RT T1 <cTitle>2023 International Conference on Networking and Communications (ICNWC)</cTitle>: T1 <Title>Modelling and Analysis of different types of TSV for Three Dimensional Integrated Circuits</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10127533&Exemplar=1&LAN=DE A1 Subhashini, G. A1 Vairaprakash, S. A1 Chandralekha, R. A1 Rajalakshmi, R. A1 Amudhadevi, A.S. A1 Ishwarya, R. YR 2023 K1 Resistance K1 Solid modeling K1 Analytical models K1 Integrated circuit interconnections K1 Time to market K1 Voltage K1 Delays SP 1 OP 10 LK http://dx.doi.org/https://doi.org/10.1109/ICNWC57852.2023.10127533 DO https://doi.org/10.1109/ICNWC57852.2023.10127533 SF ELIB - SuUB Bremen
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