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1 Ergebnisse
1
Performance Analysis of Cylindrical Through Silicon Via wit..:
, In:
2023 24th International Symposium on Quality Electronic Design (ISQED)
,
Kumari, Vandana
;
Chandrakar, Maya
;
Majumder, Manoj Kumar
- p. 1-6 , 2023
Link:
https://doi.org/10.1109/ISQED57927.2023.10129400
RT T1
2023 24th International Symposium on Quality Electronic Design (ISQED)
: T1
Performance Analysis of Cylindrical Through Silicon Via with Interfacial Crack
UL https://suche.suub.uni-bremen.de/peid=ieee-10129400&Exemplar=1&LAN=DE A1 Kumari, Vandana A1 Chandrakar, Maya A1 Majumder, Manoj Kumar YR 2023 SN 1948-3295 K1 Semiconductor device modeling K1 Three-dimensional displays K1 Crosstalk K1 Silicon K1 Delays K1 Power dissipation K1 Performance analysis K1 3D-ICs K1 Through Silicon Via K1 Coefficient of Thermal Expansion(CTE) K1 Delamination K1 CMOS driver K1 Thermal stress K1 Driver Via Load (DVL) SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ISQED57927.2023.10129400 DO https://doi.org/10.1109/ISQED57927.2023.10129400 SF ELIB - SuUB Bremen
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