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1 Ergebnisse
1
Heat Transfer Enhancement in Two-phase Immersion Cooling wi..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Tanaka, D.
;
Yuki., K.
;
Unno, N.
... - p. 179-180 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129648
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Heat Transfer Enhancement in Two-phase Immersion Cooling with FC-72</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129648&Exemplar=1&LAN=DE A1 Tanaka, D. A1 Yuki., K. A1 Unno, N. A1 Yuki, K. A1 Ide, T. A1 Ogushi, T. A1 Murakami, M. YR 2023 K1 Heating systems K1 Electric potential K1 Data centers K1 Electronic equipment K1 Immersion cooling K1 Surface structures K1 Supercomputers K1 Boiling K1 FC-72 K1 Cooling of electronic equipment SP 179 OP 180 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129648 DO https://doi.org/10.23919/ICEP58572.2023.10129648 SF ELIB - SuUB Bremen
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