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1 Ergebnisse
1
Measurement of Thermal Strain of Metallized Silicon Nitride..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Ngo, Minh Chu
;
Miyazaki, Hiroyuki
;
Hirao, Kiyoshi
. - p. 19-20 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129650
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Measurement of Thermal Strain of Metallized Silicon Nitride Substrate in Thermal Cycling Test by Digital Image Correlation Method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129650&Exemplar=1&LAN=DE A1 Ngo, Minh Chu A1 Miyazaki, Hiroyuki A1 Hirao, Kiyoshi A1 Fukushima, Manabu YR 2023 K1 Temperature measurement K1 Heating systems K1 Thermal expansion K1 Temperature distribution K1 Correlation K1 Digital images K1 Strain measurement K1 Silicon nitride K1 Metallized ceramic substrate K1 Thermal cycling test K1 DIC K1 Power module SP 19 OP 20 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129650 DO https://doi.org/10.23919/ICEP58572.2023.10129650 SF ELIB - SuUB Bremen
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