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1 Ergebnisse
1
Molecular Dynamics Simulation of Cu-Cu Solid-State Bonding ..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Tatsumi, Hiroaki
;
Kao, C.R.
;
Nishikawa, Hiroshi
- p. 149-150 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129651
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Molecular Dynamics Simulation of Cu-Cu Solid-State Bonding under Various Bonding Parameters</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129651&Exemplar=1&LAN=DE A1 Tatsumi, Hiroaki A1 Kao, C.R. A1 Nishikawa, Hiroshi YR 2023 K1 Solid modeling K1 Focusing K1 Crystals K1 Behavioral sciences K1 Bonding K1 Integrated circuit modeling K1 Three-dimensional integrated circuits K1 Solid-state bonding K1 Cu-Cu bonding K1 interfacial structure K1 molecular dynamics simulation SP 149 OP 150 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129651 DO https://doi.org/10.23919/ICEP58572.2023.10129651 SF ELIB - SuUB Bremen
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