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1 Ergebnisse
1
Hybrid SnBi/SAC Low-Temperature Solder Bump:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Wu, Albert T.
;
Chao, Jui-Lin
;
Lai, Yu-Yuan
. - p. 213-214 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129653
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Hybrid SnBi/SAC Low-Temperature Solder Bump</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129653&Exemplar=1&LAN=DE A1 Wu, Albert T. A1 Chao, Jui-Lin A1 Lai, Yu-Yuan A1 Wang, Chang-Meng YR 2023 K1 Industries K1 Annealing K1 Surface morphology K1 Morphology K1 Aging K1 Reliability K1 Soldering K1 low-temperature solder K1 SnBi K1 SAC K1 mechanical strength SP 213 OP 214 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129653 DO https://doi.org/10.23919/ICEP58572.2023.10129653 SF ELIB - SuUB Bremen
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