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1 Ergebnisse
1
Adhesive Strength and Diffusion at Interfaces between Sinte..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Ishikawa, Dai
;
Nakako, Hideo
;
Blank, Thomas
.. - p. 233-234 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129656
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Adhesive Strength and Diffusion at Interfaces between Sintered Cu Layer and Metal Surfaces (Cu, Ag, Au, Pd, Pt, Ni, NiPx, and NiBx)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129656&Exemplar=1&LAN=DE A1 Ishikawa, Dai A1 Nakako, Hideo A1 Blank, Thomas A1 Wurst, Helge A1 Steiner, Felix YR 2023 K1 Temperature measurement K1 Nanoparticles K1 Gold K1 Adhesive strength K1 Metallization K1 Sintering K1 Plating K1 Cu sintering paste K1 Diebonding K1 Metal plating K1 Diffusion SP 233 OP 234 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129656 DO https://doi.org/10.23919/ICEP58572.2023.10129656 SF ELIB - SuUB Bremen
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