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1 Ergebnisse
1
Copper and silver sintered die-attach compared in HV-H3TRB ..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Steiner, Felix
;
Ishikawa, Dai
;
Nakako, Hideo
. - p. 89-90 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129660
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Copper and silver sintered die-attach compared in HV-H3TRB and thermal shock cycling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129660&Exemplar=1&LAN=DE A1 Steiner, Felix A1 Ishikawa, Dai A1 Nakako, Hideo A1 Blank, Thomas YR 2023 K1 Silver K1 Thermal expansion K1 Electric shock K1 Thermal shock K1 Sintering K1 Dendrites (neurons) K1 Copper K1 copper K1 silver K1 sintering K1 H3TRB K1 thermal shock cycling SP 89 OP 90 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129660 DO https://doi.org/10.23919/ICEP58572.2023.10129660 SF ELIB - SuUB Bremen
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