I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Hybrid Surface Treatment for Copper-to-Copper Thermal Compr..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Shih, Liang-Hsing
;
Chen, Wei-Ting
;
Lin, Viktor
. - p. 11-12 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129664
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Hybrid Surface Treatment for Copper-to-Copper Thermal Compression Bonding Thermal Compression Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129664&Exemplar=1&LAN=DE A1 Shih, Liang-Hsing A1 Chen, Wei-Ting A1 Lin, Viktor A1 Song, Jenn-Ming YR 2023 K1 Radiation effects K1 Three-dimensional displays K1 Surface resistance K1 Silicon K1 Plasmas K1 Residual stresses K1 Copper K1 3D-IC K1 Plasma surface modification K1 Cu/Cu bonding K1 Thermocompression bonding SP 11 OP 12 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129664 DO https://doi.org/10.23919/ICEP58572.2023.10129664 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
