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1 Ergebnisse
1
Electronic Packaging Interfacial Strength Measurement and D..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Shih, Meng-Kai
;
Liu, Yu-Hao
;
Lin, Guan-Sian
.. - p. 269-270 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129671
RT T1
2023 International Conference on Electronics Packaging (ICEP)
: T1
Electronic Packaging Interfacial Strength Measurement and Delamination Investigation
UL https://suche.suub.uni-bremen.de/peid=ieee-10129671&Exemplar=1&LAN=DE A1 Shih, Meng-Kai A1 Liu, Yu-Hao A1 Lin, Guan-Sian A1 Hsu, Eddie A1 Yang, Jonny YR 2023 K1 Lead K1 Electromagnetic compatibility K1 Copper K1 Compounds K1 Thermal loading K1 Delamination K1 Analysis of variance K1 Electronic packaging K1 Reliability K1 Finite Element Analysis K1 Optimization design SP 269 OP 270 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129671 DO https://doi.org/10.23919/ICEP58572.2023.10129671 SF ELIB - SuUB Bremen
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