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1 Ergebnisse
1
Semiconductor Package Design Flow and Platform Applied on F..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Lin, Youle
;
Chang, Keng-Tuan
;
Kuo, Hung-Chun
.. - p. 21-22 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129673
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Semiconductor Package Design Flow and Platform Applied on Fan-out Chip on Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129673&Exemplar=1&LAN=DE A1 Lin, Youle A1 Chang, Keng-Tuan A1 Kuo, Hung-Chun A1 Huang, Chih-Yi A1 Wang, Chen-Chao YR 2023 K1 Integrated circuits K1 Ball grid arrays K1 System-in-package K1 High performance computing K1 Production K1 Substrates K1 2.5D package K1 fan-out chip on substrate (FOCoS) K1 flip-chip ball grid array (FCBGA) package K1 SiP-id SP 21 OP 22 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129673 DO https://doi.org/10.23919/ICEP58572.2023.10129673 SF ELIB - SuUB Bremen
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