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1 Ergebnisse
1
Global/Local Modeling Nickel-Gold Plating Process in PCB Ma..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Yeh, Yu-Kuan
;
Yao, Yuan
- p. 253-254 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129685
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Global/Local Modeling Nickel-Gold Plating Process in PCB Manufacturing for Analysis of Plating Thickness Distribution</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129685&Exemplar=1&LAN=DE A1 Yeh, Yu-Kuan A1 Yao, Yuan YR 2023 K1 Analytical models K1 Computational modeling K1 Plating K1 Product design K1 Finite element analysis K1 Quality assessment K1 Manufacturing K1 printed circuit boards K1 IC substrate K1 nickel-gold plating process K1 finite element methods K1 global/local modeling SP 253 OP 254 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129685 DO https://doi.org/10.23919/ICEP58572.2023.10129685 SF ELIB - SuUB Bremen
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