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1 Ergebnisse
1
Study of Cu Micro-via by TOF-SIMS and STEM:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Nishijima, Masahiko
;
Hsieh, Ming-Chun
;
Zheng, Zhang
... - p. 151-152 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129689
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Study of Cu Micro-via by TOF-SIMS and STEM</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129689&Exemplar=1&LAN=DE A1 Nishijima, Masahiko A1 Hsieh, Ming-Chun A1 Zheng, Zhang A1 Suetake, Aiji A1 Yoshida, Hiroshi A1 Okumuara, Rieko A1 Chen, Chuantong A1 Homma, Hidekazu A1 Kita, Koji A1 Suganuma, Katsuaki YR 2023 K1 Electric potential K1 Scanning electron microscopy K1 Transmission electron microscopy K1 Microscopy K1 Hydrogen K1 Plating K1 Electrolytes K1 Cu micro-via K1 electroless Cu K1 STEM K1 TOF-SIMS SP 151 OP 152 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129689 DO https://doi.org/10.23919/ICEP58572.2023.10129689 SF ELIB - SuUB Bremen
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