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1 Ergebnisse
1
Novel Temporary Bonding/Debonding System Enabling Advanced ..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Miyazawa, Emi
;
Enomoto, Tetsuya
;
Akasu, Yuta
... - p. 223-224 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129696
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Novel Temporary Bonding/Debonding System Enabling Advanced Packaging Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129696&Exemplar=1&LAN=DE A1 Miyazawa, Emi A1 Enomoto, Tetsuya A1 Akasu, Yuta A1 Sobue, Shogo A1 Nakamura, Yuki A1 Ogawa, Saeko A1 Kawamori, Takashi YR 2023 K1 Resistance K1 Radiation effects K1 Xenon K1 Packaging K1 Throughput K1 Wafer scale integration K1 Reliability K1 Temporary bonding/debonding K1 High heat resistance K1 Peel off K1 Xe flash light irradiation K1 Photonic release SP 223 OP 224 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129696 DO https://doi.org/10.23919/ICEP58572.2023.10129696 SF ELIB - SuUB Bremen
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