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1 Ergebnisse
1
Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Pow..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Tsai, Chin-Hao
;
Steiner, Felix
;
Ishikawa, Dai
.. - p. 97-98 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129697
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Power Module Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129697&Exemplar=1&LAN=DE A1 Tsai, Chin-Hao A1 Steiner, Felix A1 Ishikawa, Dai A1 Kao, C. Robert A1 Blank, Thomas YR 2023 K1 Printing K1 Microscopy K1 Sintering K1 Thermal shock K1 Multichip modules K1 Bending K1 Reliability K1 Electronic packaging K1 Power module K1 Sintered Ag/Cu pastes K1 Large-area sintering K1 Reliability tests SP 97 OP 98 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129697 DO https://doi.org/10.23919/ICEP58572.2023.10129697 SF ELIB - SuUB Bremen
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