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1 Ergebnisse
1
Development of High Temperature Lead-free Solders in the Al..:
, In:
2023 International Conference on Electronics Packaging (ICEP)
,
Laksono, Andromeda Dwi
;
Yen, Yee-Wen
- p. 197-198 , 2023
Link:
https://doi.org/10.23919/ICEP58572.2023.10129708
RT T1 <cTitle>2023 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Development of High Temperature Lead-free Solders in the Al-95Zn + xSn Systems</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10129708&Exemplar=1&LAN=DE A1 Laksono, Andromeda Dwi A1 Yen, Yee-Wen YR 2023 K1 Heating systems K1 Scanning electron microscopy K1 X-ray scattering K1 Lead K1 X-ray diffraction K1 Microstructure K1 Dispersion K1 high temperature lead-free solder K1 Sn-Zn-Al alloy K1 metallographic microstructure K1 liquidus SP 197 OP 198 LK http://dx.doi.org/https://doi.org/10.23919/ICEP58572.2023.10129708 DO https://doi.org/10.23919/ICEP58572.2023.10129708 SF ELIB - SuUB Bremen
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